Electronics Resurgence Initiative: Page 3 Materials and Integration
DARPA - Microsystems Technology Office · Opportunity HR001117S0056
The full proposal must be submitted via the DARPA BAA website on or before 1:00 PM, Eastern Time, November 6, 2017. If deemed compliant, the Government will evaluate all such proposals in the initial round of selections.Additionally, proposals may be submitted after the above due date until 1:00 PM, Eastern Time, January 31, 2018 which, if deemed compliant, will be reviewed at the Government’s discretion, depending upon the availability of funding. Proposers are warned that the likelihood of available funding is greatly reduced for proposals submitted after the initial closing date deadline.
Who can apply
- Unrestricted
About this opportunity
Amendment 01: The purpose of this amendment is to make administrative changes as highlighted in yellow in the attached. Original Synopsis Below: The overall goal of the Three Dimensional Monolithic System-on-a-Chip (3DSoC) program is to develop 3D monolithic technology that will enable > 50X improvement in SOC digital performance at power. 3DSOC aims to drive research in process, design tools, and new compute architectures for future designs while utilizing U.S. fabrication capabilities. The goal of the Foundations Required for Novel Compute (FRANC) program is to define the foundations required for assessing and establishing the proof of principle for beyond von Neumann compute architectures. FRANC will seek to demonstrate prototypes that quantify the benefits of such new computing architectures.
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